advanced power p-channel enhancement mode electronics corp. power mosfet simple drive requirement bv dss -100v small package outline r ds(on) 0.5 surface mount device i d - 1.2a rohs compliant & halogen-free description absolute maximum ratings@ t j =25 o c(unless otherwise specified) symbol units v ds v v gs v i d @t a =25 a i d @t a =70 a i dm a p d @t a =25 w t stg t j symbol value unit rthj-amb maximum thermal resistance, junction-ambient 3 90 /w data and specifications subject to change without notice -55 to 150 1.38 -55 to 150 parameter drain-source voltage gate-source voltage drain current 3 , v gs @ 10v thermal data parameter total power dissipation operating junction temperature range storage temperature range drain current 3 , v gs @ 10v -0.95 pulsed drain current 1 -4.8 201601281 1 AP10P500N rating -100 + 20 -1.2 halogen-free product ap10p500 series are from advanced power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. it provides the designer with an extreme efficient device for use in a wide range of power applications. the special design sot-23 package with good thermal performance is widel y preferred for all commercial-industrial surface mount applications using infrared reflow technique and suited for voltage conversion o r switch applications. g d s d g s sot-23 .
AP10P500N electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -100 - - v r ds(on) static drain-source on-resistance 2 v gs =-10v, i d =-1a - - 0.5 v gs =-4.5v, i d =-0.5a - - 0.6 v gs(th) gate threshold voltage v ds =v gs , i d =-250ua -1 - -3 v g fs forward transconductance v ds =-10v, i d =-1a - 3.3 - s i dss drain-source leakage current v ds =-80v, v gs =0v - - -25 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge i d =-1a - 10.5 17 nc q gs gate-source charge v ds =-50v - 1.5 - nc q gd gate-drain ("miller") charge v gs =-10v - 2.5 - nc t d(on) turn-on delay time v ds =-50v - 7 - ns t r rise time i d =-1a - 5 - ns t d(off) turn-off delay time r g =3.3 -17- ns t f fall time v gs =-10v - 5 - ns c iss input capacitance v gs =0v - 420 670 pf c oss output capacitance v ds =-50v - 35 - pf c rss reverse transfer capacitance f=1.0mhz - 25 - pf source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =-1a, v gs =0v - - -1.3 v t rr reverse recovery time i s =-1a, v gs =0v, - 37 - ns q rr reverse recovery charge di/dt=100a/s - 27 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test 3.surface mounted on 1 in 2 copper pad of fr4 board ; 270 /w when mounted on min. copper pad. this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 2 .
AP10P500N 65m fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature 2.01e+08 fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 0.4 0.8 1.2 1.6 2 2.4 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d = -1a v gs = -10v 0 2 4 6 8 10 0246810 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a =25 o c -10v -7.0v -6.0v -5.0v v g = -4.0v 0 1 2 3 4 5 0123456 -v ds , drain-to-source voltage (v) -i d , drain current (a) -10v -7.0v -6.0v -5.0v v g = -4.0v t a = 150 o c 0 1 2 3 4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -v sd , source-to-drain voltage (v) -i s (a) t j =25 o c t j =150 o c 0 0.4 0.8 1.2 1.6 2 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) 320 340 360 380 400 246810 -v gs , gate-to-source voltage (v) r ds(on) (m ) i d = -0.5a t a =25 o c i d = -250ua .
AP10P500N 65m fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fi g 10. effective transient thermal im p edance fig 11. drain current v.s. ambient fig 12. gate charge waveform temperature 4 0 2 4 6 8 10 12 0481216 q g , total gate charge (nc) -v gs , gate to source voltage (v) i d = -1a v ds = -50v 0.001 0.01 0.1 1 10 0.1 1 10 100 1000 -v ds , drain-to-source voltage (v) -i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s dc 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse p dm duty factor = t/t peak t j = p dm x r thja + t a t t rthja = 270 /w 0 200 400 600 800 1 21 41 61 81 101 121 -v ds , drain-to-source voltage (v) c (pf) f =1.0mhz c iss c oss c rss operation in this area limited by r ds(on) 0 0.4 0.8 1.2 1.6 25 50 75 100 125 150 t a , ambient temperature ( o c ) -i d , drain current (a) q v g -10v q gs q gd q g charge .
AP10P500N fig 13. normalized bv dss v.s. junction fig 14. total power dissipation temperature fig 15. typ. drain-source on state fig 16. transfer characteristics resistance 5 0 0.5 1 1.5 2 0 50 100 150 t a , ambient temperature( o c) p d , power dissipation(w) 0 0.4 0.8 1.2 1.6 2 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized bv dss i d = -1ma 0 400 800 1200 1600 0246810 -i d , drain current (a) r ds(on) (m ) t j =25 o c -4.5v v gs = -10v 0 1 2 3 4 5 6 0123456 -v gs , gate-to-source voltage (v) -i d , drain current (a) t j =150 o c t j =25 o c v ds = -10v t j = -55 o c .
AP10P500N marking information 6 part number : a12 a12ss date code : ss ss:2004,2008,2012,2016,2020... ss :2003,2007,2011,2015,2019... s s:2002,2006,2010,2014,2018... ss :2001,2005,2009,2013,2017... .
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